中文
English
- 作者:
- 来源:
- 日期: 2014-01-18
- 浏览次数: 1191次
Common defects in molded products and solutions :::::::::::::::
Defects
Generating reasons
Solving method
Bubble
Incomplete curing molding material
Mold temperature is too high, so that the material in the gasification or decompose certain constituent
Mold temperature or increase the holding time
Reduce mold temperature
Queliao
Die with the gap is too large or too overflow hole
Release agent amount is too large
Operating too slow or too fast
Mold adjustment tolerances and burr hole size
Adjust the appropriate timing of mold temperature and pressure
Char
Blanks in the folder into the air, warmed by compression, the resin decomposition
The use of effective deflation operations extend mold closing time, due to lower mold temperature
Warpage
Incomplete curing
The molding inappropriate
Material shrinkage is too large
Curing conditions improve
Redesign mold, so that the top of the reasonable means.
Try to evenly cooling the mold. Use shrink holder (shaper)
Matte finish
Mold temperature is too high or too low
Stick mode
Mold surface roughness
Adjust the mold temperature, generally due to lower die temperature
Use appropriate release agent
Improve the mold surface finish, should chromed
Stick mode
Molding material within a mold release agent is not added or added incorrectly
Mold surface roughness or use the new model without grinding
Pressing pressure is too high
By adding an appropriate amount of test effective internal mold release agent
Improve the mold surface finish, available pressure plastic powder and then pressed fiberglass tryout
Appropriate to reduce the pressure
Mottled surface
Die overheating
Pigment decomposed due to overheating
Reduce mold temperature
Lower curing temperature
Pinhole
Thickening material shortage
Local fiber content is too high
Surface air could not escape, insufficient quantity
Improve the thickening of the material
Improve the uniformity of materials
Reduce feeding area, increasing the molding pressure, increased by quantity
Defects
Generating reasons
Solving method
Bubble
Incomplete curing molding material
Mold temperature is too high, so that the material in the gasification or decompose certain constituent
Mold temperature or increase the holding time
Reduce mold temperature
Queliao
Die with the gap is too large or too overflow hole
Release agent amount is too large
Operating too slow or too fast
Mold adjustment tolerances and burr hole size
Adjust the appropriate timing of mold temperature and pressure
Char
Blanks in the folder into the air, warmed by compression, the resin decomposition
The use of effective deflation operations extend mold closing time, due to lower mold temperature
Warpage
Incomplete curing
The molding inappropriate
Material shrinkage is too large
Curing conditions improve
Redesign mold, so that the top of the reasonable means.
Try to evenly cooling the mold. Use shrink holder (shaper)
Matte finish
Mold temperature is too high or too low
Stick mode
Mold surface roughness
Adjust the mold temperature, generally due to lower die temperature
Use appropriate release agent
Improve the mold surface finish, should chromed
Stick mode
Molding material within a mold release agent is not added or added incorrectly
Mold surface roughness or use the new model without grinding
Pressing pressure is too high
By adding an appropriate amount of test effective internal mold release agent
Improve the mold surface finish, available pressure plastic powder and then pressed fiberglass tryout
Appropriate to reduce the pressure
Mottled surface
Die overheating
Pigment decomposed due to overheating
Reduce mold temperature
Lower curing temperature
Pinhole
Thickening material shortage
Local fiber content is too high
Surface air could not escape, insufficient quantity
Improve the thickening of the material
Improve the uniformity of materials
Reduce feeding area, increasing the molding pressure, increased by quantity